Slots: Eligible applicants may submit only one concept paper per R&D Area.
Deadlines
Internal Deadline: Friday, November 15th, 2024, 5pm PT Contact RII.
Concept Paper Deadline (required): December 20, 2024
External Deadline (invited): Full applications will be due 60 days from the date of the invitation to submit.
Award Information
Award Type: Other (research and development)
Estimated Number of Awards: 10
Anticipated Award Amount: CHIPS R&D anticipates making available up to approximately $1,550,000,000 for funding multiple awards of varying size and scope, with anticipated amounts ranging from approximately $10,000,000 to approximately $150,000,000 in Federal funds per award over a five (5) year period of performance.
Who May Serve as PI: Eligible applicants are domestic non-profit organizations; domestic accredited institutions of higher education; State, local, and Tribal governments; and domestic for-profit organizations.
Link to Award: https://www.grants.gov/search-results-detail/356762
Process for Limited Submissions
PIs must submit their application as a Limited Submission through the Research Initiatives and Infrastructure (RII) Application Portal: https://rii.usc.edu/oor-portal/. Use the template provided here: RII Limited Submission Applicant Template
Materials to submit include:
- (1) Two-Page Proposal Summary (1” margins; single-spaced; standard font type, e.g. Arial, Helvetica, Times New Roman, or Georgia typeface; font size: 11 pt). Page limit includes references and illustrations. Pages that exceed the 2-page limit will be excluded from review. You must use the template linked above. Please note which R&D Area you are applying to.
- (2) CV – (5 pages maximum)
Note: The portal requires information about the PIs in addition to department and contact information, including the 10-digit USC ID#. Please have this material prepared before beginning this application.
Purpose
This NOFO envisions projects in five (5) R&D Areas:
(1) Equipment, Tools, Processes, and Process Integration;
(2) Power Delivery and Thermal Management;
(3) Connector Technology, including Photonics and RF;
(4) Chiplets Ecosystem; and
(5) Co-design/EDA.
The 2022 CHIPS and Science Act appropriated $50 billion to the U.S. Department of Commerce (the Department’s) CHIPS for America program, to support semiconductor research and development (R&D) and to expand semiconductor manufacturing capacity in the United States. This includes $39 billion for the Department to expand domestic semiconductor manufacturing capacity through an incentives program and $11 billion to advance U.S. leadership in semiconductor R&D. These R&D advances are being realized through four programs: (1) the National Semiconductor Technology Center (NSTC), (2) the NAPMP, (3) the CHIPS Metrology Program, and (4) a CHIPS Manufacturing USA Institute. These investments, across both the R&D and incentives programs, seek to strengthen U.S. competitiveness, support domestic production and innovation, create, across the country, good jobs with working conditions consistent with the Good Jobs Principles published by the Departments of Commerce and Labor, and advance U.S. economic and national security
Visit our Institutionally Limited Submission webpage for more updates and other announcements.