Slots: A lead organization may only submit one proposal in response to this solicitation and may not appear as a subawardee on any additional proposals.
Deadlines
Internal Deadline: Wednesday, October 9th, 2024, 5pm PT Contact RII.
LOI: N/A
External Deadline: October 28th, 2024, 4pm EDT
Award Information
Estimated Number of Awards: 1
Anticipated Award Amount: $30 million over six years
Link to Award: https://sam.gov/opp/1e808bc8f585427da4b560b98e32c820/view
Process for Limited Submissions
PIs must submit their application as a Limited Submission through the Research Initiatives and Infrastructure (RII) Application Portal: https://rii.usc.edu/oor-portal/. Use the template provided here: RII Limited Submission Applicant Template
Materials to submit include:
- (1) Two-Page Proposal Summary (1” margins; single-spaced; standard font type, e.g. Arial, Helvetica, Times New Roman, or Georgia typeface; font size: 11 pt). Page limit includes references and illustrations. Pages that exceed the 2-page limit will be excluded from review. You must use the template linked above.
- (2) CV – (5 pages maximum)
Note: The portal requires information about the PIs in addition to department and contact information, including the 10-digit USC ID#. Please have this material prepared before beginning this application.
Purpose
Through this announcement, NSF, in collaboration with the CHIPS for America R&D Office and CHIPS Program Office (CPO) within the National Institute of Standards and Technology (NIST), a bureau of the DOC, is soliciting proposals and, after completion of the merit review and selection process described in this announcement, intends to make one award to a suitable organization to be the Hub. As the major element of the NNME (National Network for Microelectronics Education), the Hub will be responsible for establishing, growing, operating, coordinating, and managing the NNME with sufficient geographical extent and operational capacity to fulfill the U.S. microelectronics workforce needs.
Visit our Institutionally Limited Submission webpage for more updates and other announcements.